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Specification : TS-S00D002G September, 2001
Technical Specification for Optical Transceiver Module
SCM6001
155.52Mb/s Short Haul Intermediate Reach Single 5.0 V 1.3 m Transmitter ( 622.08Mb/s Long Haul Long Reach Single 3.3 V .com 1.55 m Receiver 2R / 3R ) ( other ____________ other ____________ other ____________ other ____________ Transceiver ( 2 X 10 ) 2R / 3R )
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Applicable Part Numbers : SCM6001-GL-ZN, SCM6001-GL-CN, SCM6001-GL-DN SCM6001-GL-ZW, SCM6001-GL-CW, SCM6001-GL-DW SCM6001-JL-ZN, SCM6001-JL-CN, SCM6001-JL-DN SCM6001-JL-ZW, SCM6001-JL-CW, SCM6001-JL-DW
Sumitomo Electric reserves the right to make changes in this specification without prior notice.
#Safety Precaution
Symbols This specification uses various picture symbols to prevent possible injury to operator or other persons or damage to properties for appropriate use of the product. The symbols and definitions are as shown below. Be sure to be familiar with these symbols before reading this specification.
Warning Caution
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Wrong operation without following this instruction may lead to human death or serious injury. Wrong operation without following this instruction may lead to human injury or property damage. indicates prohibition of actions. Action details are explained thereafter. indicates compulsory actions or instructions. Action details are explained thereafter.
Example of picture symbols
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Specification : TS-S00D002G September, 2001
1. General
Features of SCM6001 are listed below. * SDH STM-1 S-1.1 / SONET OC-3 IR-1 Compliant * Power Supply Voltage Single +3.3V * Compact Package Size 49 X 13.59 X 9.8 mm (max.) * Electrical Interface LVPECL for DATA and LVTTL for Signal Detect and Laser Disable * Fiber Coupled Power -8 ~ -15dBm (Typ. -11dBm) for SMF * Input Power Range -8 ~ -28dBm (Typ. Sensitivity -35dBm) * Monitor Functions Laser Bias Monitor, Rear Facet Monitor * Laser Disable Function * Signal Detect (SD) Function * Connector Interface LC Duplex Receptacle
2. Block Diagram
Monitor PIN PD
LD
TD TDb
Data Input Buffer Automatic Power Input Control Reference Voltage Generator Circuit
Modulation Circuit Laser Bias Circuit
Bmon+ BmonPmon+ Pmon-
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Tdis
(Laser Bias Monitor)
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Buffer
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(Rear Facet Monitor)
Figure 1. Block Diagram (Transmitter)
PIN PD
Peak Hold Circuit Front-End Amplifier Limiting Amplifier
Comparator
SD
Output Buffer
RDb RD
Figure 2. Block Diagram (Receiver)
Caution
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Do not disassemble this product. Otherwise, failure, electrical shock, overheating or fire may occur. Handle the lead pins carefully. Use assisting tools or prospective aids as required. A lead pin may injure skin or human body
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Specification : TS-S00D002G September, 2001
3. Package Dimension
3.1 SCM6001-GL-## ( With Housing Leads ) All dimensions are in mm.
Figure 3. Outline Dimensions (SCM6001-GL-Z#)
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EMI finger (Type-C)
Type-C EMI finger is an option for transceivers to be used on the card-edge with the receptacle protruding through a panel opening. It has fingers on three sides to make electrical contact with the sides of the bezel opening for grounding purpose.
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Figure 4. Outline Dimensions (SCM6001-GL-C#)
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Specification : TS-S00D002G September, 2001
All dimensions are in mm.
EMI finger (Type-D)
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Type-D EMI finger is an option for transceivers to be used on the card-edge with the receptacle protruding through a panel opening. It has fingers on four sides to make .com electrical contact with the sides of the bezel opening for grounding purpose. Figure 5. Outline Dimensions (SCM6001-GL-D#)
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Specification : TS-S00D002G September, 2001
3.2 SCM6001-JL-## ( Without Housing Leads ) All dimensions are in mm.
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Figure 6. Outline Dimensions (SCM6001-JL-Z#)
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.com EMI finger (Type-C)
Type-C EMI finger is an option for transceivers to be used on the card-edge with the receptacle protruding through a panel opening. It has fingers on three sides to make electrical contact with the sides of the bezel opening for grounding purpose. Figure 7. Outline Dimensions (SCM6001-JL-C#)
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Specification : TS-S00D002G September, 2001
All dimensions are in mm.
EMI finger (Type-D)
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.com Type-D EMI finger is an option for transceivers to be used on the card-edge with the receptacle protruding through a panel opening. It has fingers on four sides to make electrical contact with the sides of the bezel opening for grounding purpose.
Figure 8. Outline Dimensions (SCM6001-JL-D#)
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Specification : TS-S00D002G September, 2001
Figure 9. Recommended Footprint
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18.49 +/- 0.20 2.08 +/- 0.20 0.92 +/- 0.20 4.78 +/- 0.20
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2.12 +/- 0.20 6.17 +/- 0.20
Figure 10. Package Bottom View
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7654321 7654321 7654321 7654321 7654321
11.32 +/- 0.20
: Conductive area Unit : mm
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Specification : TS-S00D002G September, 2001
13.97 Min Pitch
A
A
10.16 0.10
13.25Max 15.9 Max
Top of PCB
11.82 Min
SECTION A-A [Type-C finger]
13.97 0.10
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SECTION A-A [Type-D finger] Figure 11. Recommended Bezel Design for Systems Using SFF Transceivers
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Specification : TS-S00D002G September, 2001
4. Pin Assignment
No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
N otes: 1. I/O/P stand f or signal input, signal output, and D C power/ bias supply , respectiv ely . 2. R ef er t o f igure 14 f or det ails of Bmon and Pmon outputs.
Symbol VpdR VeeR VeeR NC NC VeeR VccR SD RDb RD VccT VeeT Tdis TD TDb VeeT BmonBmon+ PmonPmon+
I/O/P1 P P P
Level +3.3V DC GND GND
Description DC Bias Supply for Re ce ive r PIN-PD. Pow e r Supply (-) for Receiver. Pow e r Supply (-) for Receiver. No Us er Connection. No Us er Connection. Pow e r Supply (-) for Receiver. Pow e r Supply (+) for Re ce iver. Signal De tect. High level indicates presence of optical input signal (Active High). Inve rte d Re ce ive r Output Data. No internal terminations are provided. Non-Inverted Re ceive r Output Data. No internal terminations are provided. Pow e r Supply (+) for Trans m itte r. Pow e r Supply (-) for Transm itter. Transm itter Dis able (Active High). Def aults to logic 0 (enable TX) w hen left open. Non-Inverted Transm itter Input Data. No internal terminations are provided. Inve rte d Trans m itte r Input Data. No internal terminations are provided.
P P O O O P P I I I P O O O O
GND +3.3V DC LVTTL LVPECL LVPECL +3.3V DC GND LVTTL/LVCMOS LVPECL LVPECL GND Analog Voltage
Pow e r Supply (-) for Transm itter. LD Bias Curre nt M onitor. Voltage diff erence betw een pins 17 and 18 is proportional to the laser bias current. Analog Voltage Rear Facet M onitor. Transmitter output pow er can be monitored, in terms of rear f acet monitor PD current, by measuring voltage dif ference betw een pins 19 and 20.
Stand-O ff
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PIN POUT Stud
* Mounting Studs are provided for mechanical support to the circuit board. It is recommended that the holes in the circuit H ou sing Lead Stand-O ff board be connected to frame ground. pin1 pin1 0 * Housing Leads are internally connected to VeeR and VeeT. .com H ou sing Lead (SCM6001-JL-## has no Housing Leads.) * Stand-Offs provide gap between the circuit board and the module to help escape residual water after aqueous wash. pin2 0 pin1 1
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Figure 12. Bottom View
5. Absolute Maximum Ratings
Parameter Storage Case Temperature Operating Case Teperature Supply Voltage Input Voltage Lead Soldering Conditions Symbol Ts Tc Vcc Vi Temperature Time min. -40 -5 -40 0.0 0 Max 85 70 85 4.0 Vcc+0.5 260 10 Unit C C V V C sec. Note 1 2 3 4 5
Notes: 1. No condensation allowed. 2. SCM6001-#L-#N 3. SCM6001-#L-#W 4. TD, TDb, Tdis 5. Measured on lead pin at 2mm (0.079in.) off the package bottom
Warning
Use the product with the rated voltage described in the specification. If the voltage exceeds the maximum rating, overheating or fire may occur.
Caution
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Do not store the product in the area where temperature exceeds the maximum rating, where there is too much moisture or dampness, where there is acid gas or corrosive gas, or other extreme conditions. Otherwise, failure, overheating or fire may occur.
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Specification : TS-S00D002G September, 2001
6. Electrical Interface
6-1. Transmitter side
( Unless otherwise specified, Vcc = 3.135 to 3.465 V and all operating temperature shall apply. )
Parameter Supply Voltage Supply Current TD, TDb Input Voltage High Low TD, TDb Input Current High Low Signal Input Rise / Fall Time Tdis Input Voltage High Low Tdis Input Current High LD Bias Monitor Voltage Rear Facet Monitor Voltage
Symbol Vcc-Vee Idtx Vih Vil Iih Iil Vdi Vei Idi Vbm Vrfm
min. 3.135 Vcc-1.17 Vcc-1.95 -10 -10 2.0 0.0 -10 0.01 0.01
Typ. 3.30 70
140 0.05
Max. 3.465 140 Vcc-0.73 Vcc-1.45 150 10 1.5 Vcc 0.8 200 0.50 0.50
Unit V mA V A nsec. V V A V V
Note 1, 2, 3 4, 5, 6 4, 5, 6 7 8
2, 9 2, 9
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Notes: 1. Input current is not included. 2. 50% duty cycle data. 3. 155.52Mbps, PRBS2^23-1, NRZ. 4. Vcc=+3.3V 5. Tc=25C 6. Input Terminal is biased internally, as shown in the figure13. 7. 20-80%. 8. LVTTL input.Refer to Section 8, "Relation between Disable Input Voltage and Optiical Output Power", for detail. 9. The Laser Bias Monitor Current and Rear Facet Monitor Current are P in 18 calculated as ratios between the corresponding voltages and current B mon+ sensing resistors, 10 and 200, as shown in the figure 14.
V cc LD
Monitor P IN -P D
3k 10
3k 200
P in 20 P mon+
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Vcc R1
LVPECL
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R 1R 2 = 1.3k ( typ.) R 1 +R 2 TD/TDb R2 R 1 +R 2 = 2.0 3.3
P in 17 B mon-
3k B ias Circ uit APC Circ uit
3k
P in 19 P mon-
R2
Figure 13. Internal Bias of Input Terminal
Figure 14. Bmon and Pmon Interface
6-2. Receiver side
Parameter Supply Voltage Supply Current RD, RDb Output Voltage High Low SD Output Voltage High Low Data Rise / Fall Time SD Assert Time SD Deassert Time Symbol Vcc-Vee Idrx Vdoh Vdol Vsoh Vsol Trd / Tfd Ta Td min. 3.135 Vcc-1.10 Vcc-1.86 2.2 0.0 2.3 2.3 Typ. 3.30 80 Max. 3.465 140 Vcc-0.86 Vcc-1.62 Vcc 0.5 1000 100 100 Unit V mA V V psec. sec sec 3 4 Note 1 2
Notes: 1. Output current is not included. 155.52Mbps, PRBS2^23-1, NRZ. 2. Vcc=3.3V, Tc=25C. Output load resistance Rl=50 to Vcc-2V for RD, RDb. 3. 20-80%. 4. 155.52Mbps, PRBS2^23-1, NRZ.
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Specification : TS-S00D002G September, 2001
7. Optical Interface
( Unless otherwise specified, Vcc = 3.135 to 3.465 V and all operating temperature shall apply. )
7-1. Transmitter side
Parameter Average Output Power Extinction Ratio Center Wavelength Spectral Width (RMS) Eye Mask for Optical Output
Notes: 1. Measured at 155.52Mbps PRBS2^23-1
Symbol min. Typ. Max. Unit Po -15.0 -11.0 -8.0 dBm Er 8.2 dB c 1261 1360 nm 4.0 nm Compliant with Bellcore GR-253 CORE and ITU G.957
Note 1 1
1.20 1.00 Normalized Amplitude 0.80 0.50 0.20 0.00 -0.20 0.00 0.15 0.35 0.65 0.85 1.00
TD High Low High Low
Relation between Input Signal and Optical Output Signal
Input Signal TDb Low High High Low ON (High) OFF (Low) Undefined Undefined Optical Output Signal
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Figure 15. Optical Pulse Mask with Fourth Order Bessel-Thomson Filter Specified in ITU-T G.957
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Warning
Do not look at the laser beam projection area (e.g. end of optical connector) with naked eyes or through optical equipment while the power is supplied to this product. Otherwise, your eyes may be injured.
7-2. Receiver side
Parameter Optical Input Wavelength Minimum Sensitivity Overload SD Assert Level SD Deassert Level SD Hysteresis Symbol Pmin Pmax Pa Pd Phys min. 1261 -8.0 -45.0 -45.0 1.0 Typ. -35.0 Max. 1580 -28.0 -28.0 -29.0 6.0 Unit nm dBm dBm dBm dBm dB Note 1, 2 1, 2 2
Notes: 1. BER=10^-10 2. Measured at the bit rate of 155.52Mbps, PRBS 2^23-1, NRZ
8. Relation between Disable Input Voltage and Optical Output Power
Tdis Input Voltage "L"(0 ~ 0.8V) "H"(2.0V ~ Vcc) Open Optical Output Power Enabled Disabled (<-45dBm) Enabled
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Specification : TS-S00D002G September, 2001
9. Recommended Interface Circuit
FB I : B LM 1 1 HA 6 0 1S G (M ur at a) 1 0u F : G R M 4 2-2 B 1 0 6K 1 0 (M ura ta ) MS 1 0u F FB I FB I 1 uF HL V ccR (+ 3. 3V ) 1 V p dR
1 0u F 1 0u F 0 .1 uF
MS
M S : M ou n tin g S tu d H L : H o u sin g L e ad
V p d(+ 3 . 3V ) 1 0u F
1 00
HL 2 0 P mo n + P m on + 2 V e eR 3 V e eR 4 NC 5 NC 6 V e eR 1 9 P mo n 1 8 B mo n + B m on + 1 7 B mo n 1 6 V ee T 1 5 TD b 1 4 TD 1 3 Td is 1 2 V ee T Td is 1 0 RD HL 1 1 V ccT HL 0 .1 u F 1 0u F FB I FB I 1 0u F V ccT(+ 3 . 3V )
1 00
: S ig na l G ND : F ram e G N D
1 uF P m on -
1 uF B m on 5 0 lin e TD b
SD 5 0 lin e R Db
2 40
7 V ccR 8 SD 9 R Db
0 .4 7 uF
TD
0 .4 7 uF RD
2 40
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N ot es: (1 ) C o mp o ne n ts o n R D/ RD b lin es, 24 0 a n d 0 .4 7u F, sh o uld b e p lace d a s clo se as p ossib le to m od u le p in s. (2 ) 0 .1 u F ca p a cit o rs o n V ccR/ V ccT lin es sh ou ld b e a s clo se a s p ossib le to m o du le p in s. (3 ) 5 0 lin e p at te rn a nd co m po n en t p lace m en ts o n R D/ RD b a nd T D/ TD b line s sh o u ld b e sym me trica l f or be t te r imp e d an ce m at chin g . (4 ) H L is in te rn ally co n n ect ed t o V ee R a n d Ve e T.
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(SCM6001-JL-## has no Housing Leads.)
Figure 16. Recommended Interface Circuit
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Specification : TS-S00D002G September, 2001
10. Reliability Test Program
GR-468-CORE Issue 1, December 1998 Laser Module HEADING TEST REFERENCE CONDITIONS 5 times/axis w/o TEC 1,500G, 0.5ms Mechanical Cond. A 20G, 20-2,000 Integrity Hz, 4min/cy, 4cy/axis Thermal Shock Delta T=100degC 0degC to 100degC Solderability (steam aging not required) Accel. Aging 85degC; rated power (High Temp.) 2,000 hrs. for pass/fail 5,000 hrs. for info. Endurance High Temp. max. storage T Storage 2,000 hrs. Low Temp. min, storage T Storage 2,000 hrs. Temperature Section 5.20 -40degC to +85degC Cycling 500 for pass/fail 1,000 for info. Damp Heat MIL-STD-202 85degC/85%RH 1,000hrs. Method 103 or or 50degC/85%RH, 3,500 IEC-68-2-3 hrs. Cyc. Moist,. Res. Sec. 5.23 Special Tests Internal MIL-STD-883 Max. 5,000ppm water .com Moisture Method 1018 vapour ESD Threshold Section 5.22 SS : Sample Size C : Maximum number of failure allowed to pass the test. Mechanical Shock Vibration MIL-STD-883 Method 2002 MIL-STD-883 Method 2007 MIL-STD-883 Method 1011 MIL-STD-883 Method 2003 (R)-4-53 Section 5.18
SAMPLING LTPD SS C 20 20 20 20 11 11 11 11 0 0 0 0 20 20 25 10 11 11
0 0
20 20
11 11 11
0 0
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20 20 -
11 11 6
0 0 -
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11. Laser Safety
This product uses a semiconductor laser system and is a laser class 1 product acceptable FDA, complies with 21CFR 1040. 10 and 1040.11. Also this product is a laser class 1 product acceptable IEC 825-1. Class 1 Laser Product
Caution
If this product is used under conditions not recommended in the specification or this product is used with unauthorized revision, classfication for laser product safety standard is invalid. Classify the product again at your responsibility and take appropriate actions.
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Specification : TS-S00D002G September, 2001
12. Other Precaution
Under such a strong vibration environment as in automobile, the performance and reliability are not guaranteed. The governmental approval is required to export this product to other countries. To dispose of these components, the appropriate procedure should be taken to prevent illegal exportation. This module must be handled, used and disposed of according to your company's safe working practice.
Warning
Be sure to carry out correct soldering for connection to peripheral circuits in order to prevent contact failure or short-circuit. Otherwise, a strong laser beam may cause eye injury, overheating or fire. Do not put this product or components of this product into your mouth. This product contaions material harmful to health.
Caution
Be sure to turn the power off when you touch this product connected to the printed circuit boards. Otherwise, electric shock may occur. Dispose this product or equipment including this product properly as an industrial waste according to the regulations.
13. Ordering Information
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SCM 6 00 1 -
L-
( LC D up lex Re cep ta cle , M eta llize d ) O pe.com p eratu re ratin g Case T e m N : T c=-5~7 0 C W : T c=-40 ~85 C EM I Shie ld F in ger O ptio n Z : W itho ut Finge r C : W ith T ype -C Finge r D : W ith T ype -D Finge r Ho using Le ad Op tion G : W ith Ho using Le ad s J : W itho ut Hou sin g Le ads
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Specification : TS-S00D002G September, 2001
14. For More Information
U.S.A. ExceLight Communications, 4021 Stirrup Creek Drive, Suite 200 Durham, NC 27703 Tel. +1-919-361-1600 / Fax. +1-919-361-1619 E-mail: info@excelight.com http://www.excelight.com Europe Sumitomo Electric Europe Ltd., 220, Centennial Park, Elstree, Herts, WD6 3SL, United Kingdom Tel.+44-208-953-8681 Fax. +44-208-207-5950 E-mail: photonics@sumielectric.com http://www.sumielectric.com Japan Sumitomo Electric Industries, Ltd. ( International Business Division ), 3-12, Moto-Akasaka 1-chome Minato-ku Tokyo 107-8468 Tel. +81-3-3423-5771 / Fax. +81-3-3423-5099 E-mail: product-info@ppd.sei.co.jp http://www.sei.co.jp/Electro-optic/index_e.html
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